Which state recently signed an MoU with Intel and 3D Glass Solutions to bring glass substrate manufacturing technology to India?

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The correct answer is Option D: Odisha. Odisha signed MoUs with Intel and 3D Glass Solutions on 28–29 May 2026 to introduce advanced glass substrate manufacturing technology in India. India’s first Advanced 3D Glass Semiconductor Packaging Unit is being established at Info Valley, Bhubaneswar, Odisha. The project was approved under the India Semiconductor Mission in August 2025. The total project investment is estimated at ₹1,943.53 crore, with central support of ₹799 crore and state support of about ₹399.5 crore. The facility is expected to manufacture around 70,000 glass substrates and 50 million assembled semiconductor units annually. The unit will also produce nearly 13,000 advanced 3D heterogeneous integration modules every year. The project will support strategic sectors such as Artificial Intelligence (AI), high-performance computing, defence electronics, and next-generation telecom systems. Odisha is also set to host India’s first commercial compound semiconductor fabrication unit, with groundbreaking scheduled for June 2026.

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Gujarat

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Karnataka

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Tamil Nadu

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Telangana

Which state recently signed an MoU with Intel and 3D Glass Solutions to bring glass substrate manufacturing technology to India?

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Which state recently signed an MoU with Intel and 3D Glass Solutions to bring glass substrate manufacturing technology to India?

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